罗杰斯PCB

Stable Dielectric Constant (Dk): Minimal Dk variation across frequency and temperature helps maintain impedance and phase stability, especially in RF and high-frequency circuits. Extremely Low Dielectric Loss (Df): Lower loss than FR-4 reduces signal attenuation and improves high-frequency signal integrity, particularly in higher GHz ranges. Low Surface Roughness Options: Smoother copper foil surfaces help reduce conductor loss caused by skin effect, which becomes more important at millimeter-wave frequencies.

Low CTE (Coefficient of Thermal Expansion): Better CTE matching (especially with copper) reduces risk of via / hole wall stress during temperature cycling—important for multilayer reliability High Tg Options: Some Rogers materials support high-temperature processing (including lead-free assembly conditions). High Temperature & Chemical Resistance: Suitable for demanding environments such as automotive electronics and aerospace-related designs.

High Dimensional Stability: Low moisture absorption improves stability under humidity and helps reduce deformation during processing and soldering. Process Compatibility: Rogers materials can be used in hybrid stackups with FR-4 to balance performance and cost (common for RF + control mixed designs).